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stage is to add the solder mask. All handling of the mask, up to
developing, should be done in subdued light and out of direct daylight
or any UV source, as it is light sensitive. You first apply the mask
using a laminating machine, I modified mine slightly as the opening was
not very tall, plus its easier to see what's going on, I just cut away
some of the casing. I peeled off the protective backing on the Green
film and laid it on the PCB, I ran it through 4 or 5 times. I then
cooled it rapidly under the cold water tap, this was not in the
instructions but a couple of tutorials on YouTube recommended this to
aid adhesion. I found it best to tape the leading edges of board/film
together and hold the film up as it was fed into the machine, this
seems to avoid creases and air bubbles. |
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